Power Driver Modules - Electronic Components Distributor - page 2

Manufacturers

CUI Inc.

Vishay General Semiconductor - Diodes Division

Tamura

Microchip Technology

TE Connectivity Corcom Filters

Analog Devices Inc./Maxim Integrated

Omron Automation and Safety

IXYS

Toshiba Semiconductor and Storage

Phoenix Contact

Microsemi Corporation

Infineon Technologies

Alpha & Omega Semiconductor Inc.

Thomas Research Products

GeneSiC Semiconductor

Sanken Electric USA Inc.

Digilent, Inc.

Trinamic Motion Control GmbH

XP Power

Laird Thermal Systems, Inc.

Samsung Semiconductor, Inc.

Adafruit Industries LLC

Seeed Technology Co., Ltd

Rochester Electronics, LLC

Powertip Technology Inc.

Mornsun America, LLC

Nippon Pulse America, Inc.

Amphenol Tuchel Industrial

Harris Corporation

Fairchild Semiconductor

International Rectifier

Sanyo

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Part Number	Manufacturer	Description	In stock	Quantity	Package	Status	Detail
BUF20800AIDCPR	Texas Instruments	IC AMP TFT-LCD 38HTSSOP	141705	RFQ	Bulk	Active	Detail
1378	Adafruit Industries LLC	IC LED DRVR LINEAR 18.5MA MODULE	5218	RFQ	10 per Pkg	Active	Detail
FSB50550AS	onsemi	MODULE SPM 500V 2A SPM5Q	4076	RFQ	Tape & Reel (TR)	Active	Detail
STGIPN3H60	STMicroelectronics	IGBT IPM MODULE 3A 600V NDIP-26L	8456	RFQ	Tube	Active	Detail
IGCM06F60GAXKMA1	Infineon Technologies	IGBT 600V 24MDIP	9107	RFQ	Tube	Active	Detail
STGIPQ5C60T-HZ	STMicroelectronics	SLLIMM NANO 2ND SERIES IPM, 3-PH	4089	RFQ	Tube	Active	Detail
STGIPQ8C60T-HZ	STMicroelectronics	IC MOTOR DRVR 13.5V-18V 26N2DIP	1962	RFQ	Tube	Active	Detail
IGCM10F60GAXKMA1	Infineon Technologies	IGBT 600V 24MDIP	2779	RFQ	Tube	Active	Detail
IGCM15F60GAXKMA1	Infineon Technologies	IGBT 600V 24MDIP	1272	RFQ	Tube	Active	Detail
NFAQ1560R43TL	onsemi	INTELLIGENT POWER MODULE (IPM),	6921	RFQ	Tube	Active	Detail
IKCM15L60GAXKMA1	Infineon Technologies	IFPS MODULES 24MDIP	2231	RFQ	Tube	Active	Detail
IKCM15F60GAXKMA1	Infineon Technologies	IFPS MODULES	6636	RFQ	Tube	Active	Detail

2 / 158 page，total 1889 results

Power Driver Modules

Power driver modules provide the physical containment for power components, usually IGBTs and MOSFETs in a half bridge or one-, two- or three-phase configurations. Power semiconductors or dies are soldered or sintered on a substrate that carries the power semiconductors and provides electrical and thermal contact and electrical insulation where needed. Power modules provide a higher power density and are in many cases more reliable and easier to cool.